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Title 40

Displaying title 40, up to date as of 7/09/2026. Title 40 was last amended 7/09/2026.
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  1. Title 40 —Protection of Environment
  2. Chapter I —Environmental Protection Agency
  3. Subchapter C —Air Programs
  4. Part 98 —Mandatory Greenhouse Gas Reporting
  5. Subpart I   View Full Text
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eCFR Content

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Title 40Protection of EnvironmentPart / Section
Chapter IEnvironmental Protection Agency1 – 1099
Subchapter CAir Programs50 – 99
Part 98Mandatory Greenhouse Gas Reporting98.1 – 98.528
Subpart IElectronics Manufacturing98.90 – 98.98
§ 98.90Definition of the source category.
§ 98.91Reporting threshold.
§ 98.92GHGs to report.
§ 98.93Calculating GHG emissions.
§ 98.94Monitoring and QA/QC requirements.
§ 98.95Procedures for estimating missing data.
§ 98.96Data reporting requirements.
§ 98.97Records that must be retained.
§ 98.98Definitions.
Table I-1 to Subpart I of Part 98
Default Emission Factors for Manufacturing Capacity-Based Threshold Applicability Determination
Table I-2 to Subpart I of Part 98
Default Emission Factors for Gas Consumption-Based Threshold Applicability Determination
Table I-3 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
Table I-4 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size
Table I-5 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
Table I-6 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing
Table I-7 To Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing
Table I-8 to Subpart I of Part 98
Default Emission Factors (1-UN2O,j) for N2O Utilization (UN2O,j)
Table I-9 to Subpart I of Part 98
Methods and Procedures for Conducting Emissions Test for Stack Systems
Table I-10 to Subpart I of Part 98
Maximum Field Detection Limits Applicable to Fluorinated GHG Concentration Measurements for Stack Systems
Table I-11 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for Use With the Stack Test Method
Table I-12 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for Use With the Stack Test Method
Table I-13 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing for Use With the Stack Test Method
Table I-14 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing for Use With the Stack Test Method
Table I-15 to Subpart I of Part 98
Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing for Use With the Stack Test Method
Table I-16 to Subpart I of Part 98
Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
Table I-17 to Subpart I of Part 98
Expected and Possible By-Products for Electronics Manufacturing
Table I-18 to Subpart I of Part 98
Default Factors for Gamma (gi,p and gk,i,p) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method
Table I-19 to Subpart I of Part 98
Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
Table I-20 to Subpart I of Part 98
Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm Wafer Sizes
Table I-21 to Subpart I of Part 98
Examples of Fluorinated GHGs Used by the Electronics Industry
Appendix A to Subpart I of Part 98
Alternative Procedures for Measuring Point-of-Use Abatement Device Destruction or Removal Efficiency
eCFR Content