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74 FR 56374, Oct. 30, 2009, unless otherwise noted.
75 FR 74818, Dec. 1, 2010, unless otherwise noted.
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At 90 FR 21227, May 19, 2025, as required by the Congressional Review Act and Public Law 119-2, the Environmental Protection Agency removed the amendments to §§ 98.3 and 98.4 made effective on Jan. 17, 2025, at 89 FR 91163, Nov. 18, 2024. As of May 19, 2025, §§ 98.3 and 98.4 reverted to the Jan. 16, 2025 version.
| Manufacturing type/process type/wafer size | N2 O |
|---|---|
| Semiconductor Manufacturing: | |
| 200 mm or Less: | |
| CVD 1-Ui | 1.0 |
| Other Manufacturing Process 1-Ui | 1.0 |
| 300 mm or greater: | |
| CVD 1-Ui | 0.5 |
| Other Manufacturing Process 1-Ui | 1.0 |
| LCD Manufacturing: | |
| CVD Thin Film Manufacturing 1-Ui | 0.63 |
| All other N2 O Processes | 1.0 |
[89 FR 31921, Apr. 25, 2024]