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Electronic Code of Federal Regulations

e-CFR data is current as of November 14, 2019

Title 40Chapter ISubchapter CPart 98Subpart I → Appendix


Title 40: Protection of Environment
PART 98—MANDATORY GREENHOUSE GAS REPORTING
Subpart I—Electronics Manufacturing


Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-typeProcess gas i
CF4C2F6CHF3CH2F2C2HF5CH3FC3F8C4F8NF3SF6C4F6C5F8C4F8O
Etching/Wafer Cleaning
1-Ui0.810.720.510.130.0640.70NA0.140.190.550.170.072NA
BCF4NA0.100.0850.0790.077NANA0.110.00400.130.13NANA
BC2F60.046NA0.0300.0250.0240.0034NA0.0370.0250.110.110.014NA
BC4F6NANANANANANANANANANANANANA
BC4F8NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
BC5F80.0012NA0.0012NANANANA0.0086NANANANANA
BCHF30.100.047NA0.049NANANA0.040NA0.00120.0660.0039NA
Chamber Cleaning
In situ plasma cleaning:
1-Ui0.920.55NANANANA0.400.100.18NANANA0.14
BCF4NA0.21NANANANA0.200.110.050NANANA0.13
BC2F6NANANANANANANANANANANANA0.045
BC3F8NANANANANANANANANANANANANA
Remote plasma cleaning:
1-UiNANANANANANANANA0.017NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
In situ thermal cleaning:
1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[81 FR 9255, Dec. 9, 2016]

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