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Electronic Code of Federal Regulations

e-CFR data is current as of November 12, 2019

Title 40Chapter ISubchapter CPart 98Subpart I → Appendix


Title 40: Protection of Environment
PART 98—MANDATORY GREENHOUSE GAS REPORTING
Subpart I—Electronics Manufacturing


Table I-16 to Subpart I of Part 98—Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing

Manufacturing type/process type/gasDefault
DRE
(percent)
MEMS, LCDs, and PV Manufacturing60
Semiconductor Manufacturing:
Plasma Etch/Wafer Clean Process Type:
CF475
CH3F97
CHF397
CH2F297
C2F697
C3F897
C4F697
C4F897
C5F897
SF697
NF396
All other carbon-based plasma etch/wafer clean fluorinated GHG60
Chamber Clean Process Type:
NF388
All other chamber clean fluorinated GHG60
N2O Processes:
CVD and all other N2O-using processes60

[78 FR 68234, Nov. 13, 2013]

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